Polishing agent

Our company has a mature product layout and technology accumulation in the field of grinding and polishing of sapphire substrate materials, silicon carbide substrate materials, and single crystal silicon substrate materials, which can achieve rapid flattening of various substrate materials, while meeting customers’ basic surface requirements such as TTV, LTV, and Warp, improving processing efficiency, extending service life, and reducing costs and increasing efficiency through material and process improvements.

Introduction:

This sapphire substrate finishing liquid is a precision chemical formulation designed for ultra-smooth surface processing of sapphire wafers. The advanced solution combines fine abrasive particles with optimized chemical action to achieve atomic-level surface perfection while effectively controlling material removal rate. It significantly reduces subsurface damage and surface roughness to meet optical and semiconductor-grade requirements.

Application:

Widely used in LED manufacturing, semiconductor devices, and optical applications, the liquid is essential for producing high-quality sapphire substrates for LED epitaxy, laser components, and consumer electronics. It’s particularly valuable for smartphone camera lenses, watch crystals, and specialized optical windows where exceptional surface finish and transparency are critical requirements. The solution supports both single-wafer and batch processing systems in modern semiconductor fabrication facilities.

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