MOLD CLEANER FOR SEMICONDUCTOR
We are a manufacturer based in China. We specialize in providing high-quality MOLD CLEANER FOR SEMICONDUCTOR for industrial clients across various sectors. Whether you need chemicals consultation or technical support, our team is here to help.
Category：Paint chemicals Own Brand：MT /MOQ:100KG /From China/ B2B only.
Introduction
Semiconductor mold cleaners MC-261 and MC-701 are thermosetting resins formed by mixing melamine resin with organic and inorganic fillers. Our mold cleaners yield good results in removing residuals left on the mold after molding with epoxy resin materials. Due to the molding conditions are the same as epoxy resin, they are easy to operate and can save time and effort.
Mold Cleaner for Semiconductor: Overview and Key Properties
| Category | Details |
|---|---|
| Chemical Type | Specialized solvent blend (semi-aqueous or solvent-based) |
| Purpose | Remove mold release agents, residues, and particles |
| Compatibility | Safe for epoxy, metal, and ceramic molds |
| Form | Liquid, aerosol, or gel |
Key Performance Properties
| Property | Specification |
|---|---|
| Cleaning Efficiency | >99% residue removal |
| Drying Time | <5 min (room temp) |
| Surface Tension | <30 dynes/cm |
| Non-Volatile Content | <50 ppm |
| Particle Count | <10 particles/mL (>0.1 µm) |
Formulation Components
| Component | Function | Content (%) |
|---|---|---|
| Solvents | Residue dissolution | 60-90 |
| Surfactants | Particle suspension | 5-15 |
| Corrosion Inhibitors | Metal protection | 1-5 |
| Chelating Agents | Ionic contamination control | 0.5-3 |
Cleaning Process Parameters
| Parameter | Optimal Range |
|---|---|
| Temperature | 20-50°C |
| Ultrasonic Frequency | 40-80 kHz |
| Contact Time | 1-10 min |
| Rinse | DI water or solvent |
Applications
| Process Stage | Target Contaminants | Equipment Compatibility |
|---|---|---|
| Post-Molding | Epoxy bleed, release agents | Transfer molds |
| Pre-Assembly | Handling residues | Lead frames |
| Maintenance | Carbon deposits | Ejector pins |
Comparison with Alternatives
| Feature | Semiconductor Mold Cleaner | General Degreaser | Plasma Cleaning |
|---|---|---|---|
| Particle Control | Ultra-low (<10) | High (>1000) | None |
| Material Safety | Non-damaging | May attack polymers | Thermal risk |
| Throughput | High (batch processing) | Medium | Low |
Safety & Compliance
| Parameter | Standard |
|---|---|
| VOC Content | <300 g/L (EPA Method 24) |
| SEMI Compliance | SEMI F72-0708 |
| Storage | 12 months @ 15-25°C |
Market Data
| Segment | Market Share | Growth (CAGR) |
|---|---|---|
| Packaging | 45% | 6.2% |
| Foundry | 35% | 5.8% |
| OSAT | 20% | 7.1% |
Key Advantages and Limitations
| Advantages | Limitations |
|---|---|
| Precision contamination control | Higher cost vs industrial cleaners |
| Zero mold damage | Requires optimized process parameters |
| Compatible with sensitive materials | Special disposal requirements |
Summary
Semiconductor-grade mold cleaners deliver unmatched precision for advanced packaging, combining ultra-clean performance with material safety. Their optimized formulations address the industry’s escalating demands for yield and reliability in heterogeneous integration.
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