Polishing agent

Our company covers a wide range of metal polishing fields, and can provide mirror-level and super-mirror-level polishing solutions for various metal materials such as bowl alloys, copper, aluminum, and stainless steel. The product system has various forms and properties such as polishing liquid, polishing wax, and grinding paste, which are used in multiple fields such as mobile phone frames, copper-clad boards, decorative logos, structural appearance, etc., and can meet different usage scenarios such as polishing discs, five-axis machines, polishing wheels, and roll-to-roll.

Introduction:

This indium phosphide (InP) polishing paste is a specialized chemical-mechanical planarization (CMP) material formulated for precision processing of InP substrates. The paste contains ultra-fine abrasive particles in a pH-balanced chemical carrier, enabling controlled material removal while minimizing surface defects. Designed to achieve atomic-level smoothness, it preserves the critical crystalline structure of InP wafers, essential for maintaining their superior electronic and photonic properties.

Application:

The paste is widely used in compound semiconductor manufacturing for producing optoelectronic devices, including high-speed transistors, laser diodes, and photonic integrated circuits. It serves critical roles in fabricating components for fiber-optic communications, infrared detectors, and 5G/6G wireless technologies. The formulation is optimized for both industrial-scale production and research applications requiring exceptional surface quality on InP wafers.

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