High-Temperature Pressure-Sensitive Adhesive
Coating materials 2025-04-25
| Item | Description |
|---|---|
| Product Name | High-Temperature Pressure-Sensitive Adhesive |
| Main Application | Used in automotive, electronics, and industrial applications requiring high-temperature resistance |
| Product Features | – High-Temperature Resistance: Capable of withstanding temperatures up to 260°C.<br>- Strong Adhesion: Provides strong bonding to various substrates including metals, plastics, and glass.<br>- Durability: Resistant to UV, moisture, and chemical exposure.<br>- No Residue: Leaves no residue after removal. |
| Physical Properties | – Appearance: Clear or slightly colored liquid.<br>- Solid Content (N.V%): 35-45%<br>- Viscosity (cps): 1500-2500 at 25°C<br>- Drying Time: 10-20 minutes at room temperature (20-30°C) |
| Usage Method | – Surface Preparation: Clean the substrate thoroughly to remove any dirt, grease, or contaminants.<br>- Application: Apply the adhesive evenly using a brush, roller, or spray gun.<br>- Drying: Allow the adhesive to dry at room temperature for 10-20 minutes.<br>- Bonding: Apply pressure to ensure strong adhesion.<br>- Post-Processing: Inspect the finished product for uniformity and quality. |
| Storage Conditions | Store in a cool, dry place, away from direct sunlight and heat sources. Recommended storage temperature is 10-30°C. |
| Packaging | Available in 1-liter or 5-liter containers. |
| Notes | – Ensure proper ventilation during application.<br>- Wear protective gloves and goggles to avoid skin and eye contact.<br>- Clean tools and equipment immediately after use to prevent drying and clogging. |
This high-temperature pressure-sensitive adhesive is designed for applications requiring extreme temperature resistance and strong bonding. It can withstand temperatures up to 260°C, making it ideal for automotive, electronics, and industrial use. The adhesive provides excellent durability, UV resistance, and no residue after removal, ensuring high performance in demanding environments.
