Special powder coatings

Product Overview：

Our Epoxy Powder Encapsulation Materials (EPEM) are premium-grade, thermosetting chemical formulations engineering specifically for the insulation, sealing, and structural protection of electronic components. Combining high-purity epoxy resins, latent curing agents (hardener), mineral fillers (such as fused silica), and proprietary flame retardants, this material is delivered as a fine, free-flowing granulated powder optimized for automated electrostatic fluid bed coating, fluid bed dipping, and transfer molding processes.

Designed to meet the stringent reliability standards of 2026 automotive, industrial, and consumer electronics, our EPEM series provides an impenetrable barrier against moisture, thermal shock, mechanical impact, and electrical breakdown.

Product Features & Advantages：

Exceptional Moisture Resistance: Formulated to successfully pass IPC/JEDEC Moisture Sensitivity Level 2 (MSL 2) and MSL 3 testing, drastically reducing the “popcorn effect” during reflow soldering.

Superior Adhesion: Modified with specialized adhesion promoters that create robust covalent bonds across diverse substrates, including Bare Copper, Silver-plated Leadframes, FR4, and Ceramic surfaces.

Thermal Shock Endurance: Demonstrates zero delamination or cracking after 1,000 continuous thermal cycles ranging from $-55^\circ\text{C}$ to $+150^\circ\text{C}$.

Excellent Flowability: Controlled particle size distribution (typically D50 within 40–70 $\mu$m) ensures void-free, uniform encapsulation around complex geometries and under tight wire-bond clearances.

The following data represents standard verified baseline properties for our high-reliability encapsulation grades (tested under applicable ASTM and IPC-TM-650 standards):

A. Thermal & Physical Properties

• Glass Transition Temperature ($T_g$): $145^\circ\text{C}$ to $165^\circ\text{C}$ (via DSC), ensuring excellent structural stability at high operating temperatures.

• Coefficient of Thermal Expansion (CTE):

  • $\alpha_1$ (Below $T_g$): $22 \times 10^{-6}/\text{K}$ to $28 \times 10^{-6}/\text{K}$

  • $\alpha_2$ (Above $T_g$): $70 \times 10^{-6}/\text{K}$ to $90 \times 10^{-6}/\text{K}$

  • Note: Low CTE minimizes interfacial thermomechanical stress against copper/silicon substrates.

• Thermal Conductivity: $0.8$ to $1.2\text{ W/m}\cdot\text{K}$ (optimized via fused silica filler distribution for localized heat dissipation).

• Mold Shrinkage: Extremely low ($0.4\%$ to $0.6\%$), preventing component warpage and micro-cracking during curing.

B. Electrical & Insulation Performance

• Dielectric Strength: $\ge 25\text{ kV/mm}$ (at $25^\circ\text{C}$, 50Hz), providing superior high-voltage insulation in compact footprints.

• Volume Resistivity: $\ge 1.0 \times 10^{15}\ \Omega\cdot\text{cm}$ under dry ambient conditions; maintains $\ge 1.0 \times 10^{13}\ \Omega\cdot\text{cm}$ post-Moisture Sensitivity Level (MSL) testing.

• Dielectric Constant ($D_k$): $3.8$ to $4.2$ (at 1 MHz).

• Dissipation Factor ($D_f$): $\le 0.015$ (at 1 MHz).

C. Chemical & Processing Attributes

• Gel Time: 35 to 60 seconds (at $170^\circ\text{C}$), allowing for rapid, high-throughput automated production lines.

• Flame Retardancy: Fully compliant with UL 94 V-0 (at $\ge 0.8\text{ mm}$ thickness), engineered using environmentally friendly halogen-free systems.

• Hydrolytic Purity: Extractable $Cl^- < 10\text{ ppm}$, $Na^+ < 5\text{ ppm}$ to eliminate the risk of electrochemical corrosion on bond pads and micro-wiring.

Applications：

Automotive parts

Semiconductor devices

Semiconductor wafers

Electronic components

Heat-resistant components

Storage, Packaging, and Shelf Life：

Storage Conditions: Epoxy powder is a chemically reactive thermosetting system. It must be stored in its original sealed airtight packaging in a climate-controlled cold storage environment at temperatures between $2^\circ\text{C}$ and $8^\circ\text{C}$. Avoid exposure to moisture and direct sunlight.

Shelf Life: 6 months from the date of manufacture when stored at the designated cold temperatures.

Packaging: Available in standard 10 kg or 20 kg moisture-barrier PE-lined boxes.

Pre-heating Note: Before opening the container for production, the powder must be allowed to equilibrate to room temperature ($22^\circ\text{C}$ to $25^\circ\text{C}$) for at least 24 hours to prevent moisture condensation within the material.

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