ELECTRONIC GRADE STRIPPER
We are a manufacturer based in China. We specialize in providing high-quality ELECTRONIC GRADE STRIPPER for industrial clients across various sectors. Whether you need chemicals consultation or technical support, our team is here to help.
Category：Paint chemicals Own Brand：MT /MOQ:100KG /From China/ B2B only.
Introduction
Stripper for TFT-LCD. When used in the TFT-LCD process, Stripper will be heated before immersing the glass substrate, and then Rinse with solvent to remove water. The main function of Stripper is to remove the excess photoresist after the line etching is completed.
| Category | Details |
|---|---|
| Primary Function | Removal of photoresist, solder masks, conformal coatings |
| Key Applications | – PCB Manufacturing: Post-etch cleaning – Semiconductor: Wafer photoresist stripping – Advanced Packaging: Underfill removal – Rework: Component debonding |
| Technical Features | – Stripping Speed: <2 min @40°C – Residue Limit: <10μg/cm² (ion chromatography) – Material Compatibility: Copper, gold, epoxy – Flash Point: >93°C (non-flammable) |
| Safety Profile | – Toxicity: Non-carcinogenic (no DMAc/NMP) – Corrosivity: pH 7-9 (neutral formulation) – PPE Requirements: Chemical-resistant gloves, goggles – Storage: 5-30°C, away from oxidizers |
| Environmental Impact | – VOC Content: <1% (water-based) – Waste Disposal: Neutralization followed by biological treatment – Eco-Certifications: RoHS, WEEE compliant – Carbon Footprint: Reduced packaging (recycled HDPE containers) |
| Formulation Options | – Customizable Viscosity: 50-500cPs – Additives: Corrosion inhibitors, wetting agents – Packaging: 1L-200L drums with nitrogen blanket |
| Market Trends | – Growth Drivers: Miniaturization of electronics, 5G infrastructure – Regulatory Pressures: REACH, TSCA compliance – Sustainability: Transition to bio-based solvents |
| Quality Standards | – Particle Count: <100 particles/mL (>0.5μm) – Metal Ion Content: <1ppb (ICP-MS analysis) – Shelf Life: 24 months from production date |
Note: Critical for high-precision electronic assembly. Advanced formulations enable selective stripping without damaging delicate substrates.
Performance Requirements
| Parameter | Electronic Grade | Industrial Grade |
|---|---|---|
| Purity | ≥99.999% | ≥99% |
| Metal Impurities | ≤0.1 ppb | ≤10 ppm |
| Particle Count | ≤5 particles/mL | Not controlled |
| Water Content | ≤5 ppm | ≤1000 ppm |
Common Chemical Compositions
| Type | Active Ingredients | Best For |
|---|---|---|
| Solvent-Based | DMSO, NMP, glycol ethers | Thick photoresist removal |
| Alkaline | TMAH, KOH solutions | Positive tone resists |
| Acidic | Sulfuric acid/hydrogen peroxide | Post-etch cleaning |
| Semi-Aqueous | Hydroxylamine mixtures | Ion-free residue removal |
Applications in Electronics
Usage in Semiconductor Processes
| Manufacturing Step | Function | Technical Benefit |
|---|---|---|
| Photolithography | Resist stripping | Pattern fidelity preservation |
| Etch Processes | Post-etch cleaning | Metal ion contamination control |
| Wafer Bonding | Surface preparation | Improved adhesion |
| Packaging | Flux residue removal | Reliability enhancement |
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