1High Production Efficiency

2 frames / 3 minutes.

2Fluidized Bed

The fluidized bed of the encapsulation machine is constructed using filter paper, filter cloth, and similar materials, ensuring uniform powder fluidization. The powder looseness can be adjusted by controlling the airflow. The effective size of the fluidized bed is 750 × 480 mm.

3Powder Dipping Mechanism

The powder dipping mechanism is driven by a Panasonic servo motor and consists of a ball screw and linear guide rail system. The dipping control accuracy reaches ±0.1 mm.

4Encapsulation Height of Leads

The encapsulation height of the component leads is less than 3 mm, with excellent consistency and no missed coating.

5Combined Heating

A combined heating method of hot air circulation and radiation is adopted, offering high heating efficiency. The heating power is 14.4 kW, with a maximum temperature of 180°C and temperature uniformity of ±5°C.

6PLC Touchscreen Control

The control system is operated by PLC. Parameters such as encapsulation cycles, dipping depth, and dipping time can be conveniently set via a touchscreen. The encapsulation cycles can be set from 1 to 99 times. Different dipping depths and times can be programmed according to process requirements. The maximum component encapsulation height is 80 mm.

7Dust Removal System

The equipment is equipped with a powerful vertical dust removal system, capable of removing most of the dust generated during fluidization.

8Transparent Dust-Proof Shield

A transparent dust-proof shield is installed on the front panel to prevent operators from inhaling dust and to avoid accidents caused by improper operation while the machine is running.

9Cooling System

The equipment is equipped with a cooling system.

1. Preheating

The initial heating process after electronic components enter the encapsulation machine.

2. Fluidization

Compressed air passes through an airflow homogenizing device, causing the insulating powder in the fluidized bed to enter a “boiling” state, also known as the “fluidized” state.

3. Static Powder State

After fluidization, the insulating powder rapidly settles under a slight airflow, forming a relatively “static” state of the powder.

4. Powder Scraping

After the static powder stage, a scraper moves from right to left, removing excess powder above the reference line and pushing it to the left side, so that the surface of the encapsulation material is level. This ensures consistent lead height of all components during powder dipping.

5. Powder Dipping

After scraping, the heated components are immersed into the powder, allowing the powder to adhere to the outer surface of the components.

6. Hammer Vibration

After powder dipping, the frame carrying the electronic components rises to the middle position, and a cylinder strikes the frame to shake off excess powder from the bottom of the components.

7. Vibration

After the components are immersed in the powder, a vibrator operates to promote rapid flow of the powder.

8. Leveling (Flow Coating)

The final heating process after powder dipping, during which the powder changes from a solid state to a molten state, eventually forming a smooth and glossy coating film on the surface of the electronic components.