Electronic Components Epoxy Powder Encapsulation Machine
Powder Coating Lines 2026-06-18
Electronic Components Epoxy Powder Encapsulation Machine is widely applicable to the electronic component industry, such as ceramic chip capacitors, varistors, monolithic capacitors, PP/PET film wound capacitors, PTC components, etc., with a maximum encapsulation diameter of 40mm. The machine is simple to operate and has a reasonable structure, and has been adopted by many electronic component manufacturers. Electronic components that use thermosetting epoxy resin for insulation encapsulation include: PP/PET metallized film capacitors, polyester film capacitors, ceramic chip capacitors, varistors, safety capacitors, monolithic capacitors, tantalum capacitors, specially shaped high-voltage capacitors, filter components, NTCs, PTCs, and small integrated circuit components.
Applicable Components:
Epoxy powder external insulation encapsulation for segmented varistors, thermistors, resistor arrays, medium and high voltage ceramic capacitors, monolithic capacitors, metallized film capacitors, thick film circuits, varistors for SPDs, etc.
1、 Overview：
The electronic component epoxy powder encapsulation machine uses hot-melt coating technology to provide external insulation encapsulation for electronic components. It is widely used for the external insulation coating of ceramic capacitors, varistors, film capacitors, PTC, NTC, mica capacitors, and other electronic components.
The Powder Encapsulation Machine is a series of products developed by our institute through more than 20 years of continuous research and development. It features independent intellectual property rights and has obtained 5 national invention patents. In particular, its key technologies—such as fluidized bed technology, powder dipping mechanism, heating system, and control methods—have won provincial and ministerial-level Science and Technology Progress Awards, as well as the Second Prize of the National Science and Technology Progress Award in 2007.
2、The main technical features of the Powder Encapsulation Machine are as follows:
(1) High production efficiency: 2 frames / 3 minutes.
(2) The fluidized bed of the encapsulation machine is constructed using filter paper, filter cloth, and similar materials, ensuring uniform powder fluidization. The powder looseness can be adjusted by controlling the airflow. The effective size of the fluidized bed is 750 × 480 mm.
(3) The powder dipping mechanism is driven by a Panasonic servo motor and consists of a ball screw and linear guide rail system. The dipping control accuracy reaches ±0.1 mm.
(4) The encapsulation height of the component leads is less than 3 mm, with excellent consistency and no missed coating.
(5) A combined heating method of hot air circulation and radiation is adopted, offering high heating efficiency. The heating power is 14.4 kW, with a maximum temperature of 180°C and temperature uniformity of ±5°C.
(6) The control system is operated by PLC. Parameters such as encapsulation cycles, dipping depth, and dipping time can be conveniently set via a touchscreen. The encapsulation cycles can be set from 1 to 99 times. Different dipping depths and times can be programmed according to process requirements. The maximum component encapsulation height is 80 mm.
(7) The equipment is equipped with a powerful vertical dust removal system, capable of removing most of the dust generated during fluidization.
(8) A transparent dust-proof shield is installed on the front panel to prevent operators from inhaling dust and to avoid accidents caused by improper operation during machine running.
(9) The equipment is equipped with a cooling system.
3、Technical Specifications：
(1) Power Supply: 3-phase, 380V / 50 Hz, 18 kW
(2) Air Supply: 0.35 MPa < P < 0.8 MPa
(3) Production Efficiency: 2 frames / 3 minutes
(4) Effective Fluidized Bed Area: 980 mm × 520 mm, powder capacity approx. 20 kg
(5) Maximum Encapsulation Component Height: 80 mm
(6) Status Display & Parameter Input: Touchscreen
(7) Encapsulation Cycle Setting: 1–99 cycles
(8) Encapsulation Depth Setting: Adjustable to different depths (each cycle can have a different depth)
(9) Powder Dipping Time Setting: Adjustable (each cycle can have a different time setting)
(10) Dust Collector: Removes most of the dust generated during fluidization
(11) Heating Power: 0.4 kW × 36 units = 14.4 kW
(12) Maximum Temperature of Insulation Chamber: 200°C
(13) Powder Dipping Mechanism: Servo motor, 0.75 kW
(14) Machine Dimensions: 1300 × 1440 × 2380 mm (L × W × H)
(15) Weight: Approx. 800 kg
Overall Structure Diagram of the Encapsulation Machine
4、Component Names as Follows:
| 1.Heating Switch | 2.Low Pressure Setpoint | 3.Low Pressure Gauge Display |
| 4.Set Pressure Gauge Display | 5.High Pressure Setpoint | 6.High Pressure Gauge Display |
| 7.Scraper Trolley | 8.Feeding Inlet (Encapsulation Material) | 9.Ball Screw |
| 10.Linear Guide Rail | 11.Worm Gear Servo Motor | 12.Stirring Motor |
| 13.Touchscreen | 14.Preheating Switch | 15.Encapsulation Completion Indicator Light |
| 16.Stop Button Indicator Light | 17.Start Button Switch | 18.Preheating Furnace |
| 19.Dust Collection Hood | 20.Power Switch | 21.Power Indicator Light |
| 22.Vibration Voltage Display | 23.Vibration Voltage Adjustment | 24.Hammer Vibration Switch |
| 25.Dust Removal System | 26.Temperature Controller |
5、The powder encapsulation process is shown in the figure below.
Preheating:
The initial heating process after electronic components enter the encapsulation machine.
Fluidization:
Compressed air passes through an airflow homogenizing device, causing the insulating powder in the fluidized bed to enter a “boiling” state, also known as the “fluidized” state.
Static Powder State:
After fluidization, the insulating powder rapidly settles under a slight airflow, forming a relatively “static” state of the powder.
Powder Scraping:
After the static powder stage, a scraper moves from right to left, removing excess powder above the reference line and pushing it to the left side, so that the surface of the encapsulation material is level. This ensures consistent lead height of all components during powder dipping.
Powder Dipping:
After scraping, the heated components are immersed into the powder, allowing the powder to adhere to the outer surface of the components.
Hammer Vibration:
After powder dipping, the frame carrying the electronic components rises to the मध्य position, and a cylinder strikes the frame to shake off excess powder from the bottom of the components.
Vibration:
After the components are immersed in the powder, a vibrator operates to promote rapid flow of the powder.
Leveling (Flow Coating):
The final heating process after powder dipping, during which the powder changes from a solid state to a molten state, eventually forming a smooth and glossy coating film on the surface of the electronic components.
6、Structure Confirmation：
| Main Structure | Description |
| Human-Machine Interface | HMI (Human-Machine Interface) |
| Main Control Section | PLC |
| Transmission System (In-house Developed) | Servo System |
| Ball Screw / Linear Guide Rail | |
| Servo Reducer | |
| Inverter | |
| Gear Motor | |
| Pneumatic System | Solenoid Valve |
| Pressure Sensor | |
| Air Filter Regulator | |
| Heating System (In-house Developed) | Heater |
| Temperature Controller | |
| Powder Bed Section (In-house Developed) | Four-layer structure, patented |
| Dust Removal System (In-house Developed) | Bag type, powder box, standard configuration |
| Feeding System (In-house Developed) | / Optional (generally not required) |
| Cooling System | Xi’an Chengde |
Specifications
| Specification Item | Parameter |
| Rated Power | 18 kW (max) |
| Operating Power | / |
| Maximum Air Consumption | ≥ 0.35 m³/min |
| Heater Power | 14.4 kW |
| Dust Collector Power | 1.1 kW |
| Chiller Power | 1.0 kW |
| Fluidized Powder Bed (Dimensions) | 980 × 520 × 120 (max) |
| Encapsulation Thickness Tolerance | ± 0.2 mm |
| Encapsulation Length Tolerance | / |
| Servo Motor | 750 W |
7、Performance Parameters
| Performance Item | Parameter | Control Accuracy |
| Powder Dipping Cycles | 0–99 times, adjustable | / |
| Dipping Height | 0–80 mm, adjustable | 0.1 mm |
| Hammer Vibration Cycles | 0–5 times, adjustable | / |
| Dipping Time | 0–9.9 s, adjustable | 0.1 s |
| Dipping Speed | / | / |
| Powder Loosening Time | 0–99 s, adjustable | 1 s |
| Powder Loosening Air Pressure | > 0.35 MPa, adjustable | / |
| Preheating Time | 0–99 s, adjustable | 1 s |
| Settling Time | 0–99 s, adjustable | 1 s |
| Leveling (Scraping) Time | 0–99 s, adjustable | 1 s |
| Feeding Time | / | / |
| Heating Method | Infrared radiation + hot air circulation | ±3°C |
