Bonding Powder for Electronic Iron Powder Cores
We are a manufacturer based in China, specializing in high-quality Bonding Powder for Electronic Iron Powder Cores for industrial clients worldwide. Technical support and custom formulation available.
Category：powder Coating | Brand：MT
Introduction
Bonding Powder for Electronic Iron Powder Cores is a thermosetting epoxy-modified binder formulated for molding electronic soft magnetic iron powder cores. It is designed to improve bonding between metal powder particles while supporting dimensional stability, molding performance, and the mechanical integrity of cured components. The appropriate addition rate and curing conditions should be established according to the metal powder formulation and component requirements.
Key Features
Strong Particle Bonding
Designed to provide adhesion between metal powder particles and help form a cohesive molded core.
Low Curing Shrinkage
Helps reduce dimensional changes associated with curing and supports component precision.
Molding Performance
Dispersibility and lubricity help reduce friction between metal powders and the mold during pressing.
Mechanical Properties
Designed to support the rigidity, flexibility, and impact resistance of cured components.
Electrical and Thermal Performance
The source specifies an operating temperature range of −65°C to 110°C. Confirm the applicable electrical and thermal test data for the finished core.
Chemical Resistance
The cured binder is described as resistant to various chemicals and solvents. Performance depends on the exposure conditions.
Product Properties
| Property | Specification | Description |
|---|---|---|
| Mechanical Strength | High | Supports the mechanical integrity of molded components. |
| Curing Shrinkage | Low | Helps maintain dimensional stability during curing. |
| Processing Performance | Good dispersibility and lubricity | Facilitates powder mixing and molding. |
| Electrical Properties | High glass transition temperature; stated operating range −65°C to 110°C | Verify electrical performance under the intended operating conditions. |
| Chemical Resistance | Described as resistant to chemicals and solvents | Actual resistance depends on the chemical and exposure conditions. |
| Solid Content | Stated as 100% | Confirm the value using the product technical data sheet. |
Addition Rate and Processing
Recommended Addition Rate
15–30%
Of the total metal powder volume, subject to formulation and component requirements.
Mixing
Mix Before Molding
Blend the bonding powder with the metal powder and other formulation components as required.
Additional Lubricant
Not Normally Required
The source states that no additional lubricant is needed when using this product.
Application Method
Mixing and Molding
Add the bonding powder according to the formulation, mix thoroughly with the metal powder and other components, and then press the mixture into the required core shape.
Curing
Place the molded components in an oven for curing. Use the specified component surface temperature and validated curing time to achieve the required bonding strength.
The original information does not provide a numerical curing temperature or curing time. Confirm the recommended curing schedule with the manufacturer before production.
Health and Safety
Handling
Follow the product safety data sheet and workplace procedures when handling the powder.
Flammability
The source describes the product as non-flammable. Verify this classification against the current safety data sheet.
Regulatory Reference
The original source lists GB 15607-1995. Confirm the standard’s applicability and current status before publication.
Storage and Precautions
Storage Conditions
- Store in a ventilated, dry area below 27°C.
- Keep away from heat sources, corrosive chemicals, and solvents.
- Protect from strong light and keep the packaging sealed.
- Do not stack more than five layers or subject packages to prolonged pressure.
Storage Period
The source recommends use within three months when stored at 27°C. If the storage period is exceeded, verify product performance before use.
Contact our team for technical details, recommended addition rates, curing guidance, and sample options for bonding powder used in electronic soft magnetic iron powder cores.
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