2,3-difluoro-4-ethoxyphenylboronic acid
We are a manufacturer based in China, specializing in high-quality 2,3-difluoro-4-ethoxyphenylboronic acid for industrial clients worldwide. Technical support and custom formulation available.
Category：Semiconductor Display Materials | Brand：MT
Factory Direct
7-30 Days Lead Time
MOQ: 100KG
Global Export
Introduction
| Section | Details |
|---|---|
| Chemical Structure | Name: 2.3-Difluoro-4-ethoxyphenylboronic acid Formula: C₈H₉BF₂O₃ CAS No.: 212386-71-5 Molecular Weight: 201.963 Structure: Phenylboronic acid derivative with two fluoro substituents at positions 2 and 3. and an ethoxy group at position 4. |
| Physical Properties | Appearance: Solid Melting Point: 151-154°C Boiling Point: 316.0±52.0°C (Predicted) Density: 1.29 g/cm³ Vapor Pressure: 0.002Pa at 25°C Water Solubility: 145mg/L at 20°C Storage Conditions: Inert atmosphere, 2-8°C. |
| Chemical Properties | Acidity (pKa): 7.69±0.58 (Predicted) Safety: Irritant (Xi hazard class). |
| Synthesis Methods | Involves multi-step reactions under inert atmosphere and low temperatures. Key steps include: – Lithiation of bromo precursor. – Reaction with boron reagents at cryogenic temperatures. – Work-up and purification to isolate the final product. Detailed conditions require consultation with chemical literature or experts. |
| Applications | Chemical Industry: Used as welding agents, multifunctional lubricants, and flame retardants. Organic Synthesis: Key intermediate in pharmaceuticals, chemicals, and materials due to its fluoro and ethoxy substitutions. |
| Supplier Information | Suppliers: Shanghai Hewens Chemical Co., Ltd., Hubei Nuona Technology Co., Ltd. Price: Varies by supplier and packaging; contact suppliers for quotes. |
Disclaimer: The abovecontent is for reference and communication only among industry insiders, and does not guarantee its accuracy or completeness. According to relevant laws and regulations and the regulations of this website, units or individuals who purchase related items should obtain valid qualifications and qualification conditions.
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