Semiconductor Display Materials

Section	Details
Chemical Structure	Name: 2.3-Difluoro-4-ethoxyphenylboronic acid Formula: C₈H₉BF₂O₃ CAS No.: 212386-71-5 Molecular Weight: 201.963 Structure: Phenylboronic acid derivative with two fluoro substituents at positions 2 and 3. and an ethoxy group at position 4.
Physical Properties	Appearance: Solid Melting Point: 151-154°C Boiling Point: 316.0±52.0°C (Predicted) Density: 1.29 g/cm³ Vapor Pressure: 0.002Pa at 25°C Water Solubility: 145mg/L at 20°C Storage Conditions: Inert atmosphere, 2-8°C.
Chemical Properties	Acidity (pKa): 7.69±0.58 (Predicted) Safety: Irritant (Xi hazard class).
Synthesis Methods	Involves multi-step reactions under inert atmosphere and low temperatures. Key steps include: – Lithiation of bromo precursor. – Reaction with boron reagents at cryogenic temperatures. – Work-up and purification to isolate the final product. Detailed conditions require consultation with chemical literature or experts.
Applications	Chemical Industry: Used as welding agents, multifunctional lubricants, and flame retardants. Organic Synthesis: Key intermediate in pharmaceuticals, chemicals, and materials due to its fluoro and ethoxy substitutions.
Supplier Information	Suppliers: Shanghai Hewens Chemical Co., Ltd., Hubei Nuona Technology Co., Ltd. Price: Varies by supplier and packaging; contact suppliers for quotes.

 

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