2,3-difluoro-4-ethoxyphenylboronic acid

Semiconductor Display Materials 2025-03-04

Section Details
Chemical Structure Name: 2.3-Difluoro-4-ethoxyphenylboronic acid
Formula: C₈H₉BF₂O₃
CAS No.: 212386-71-5
Molecular Weight: 201.963
Structure: Phenylboronic acid derivative with two fluoro substituents at positions 2 and 3. and an ethoxy group at position 4.
Physical Properties Appearance: Solid
Melting Point: 151-154°C
Boiling Point: 316.0±52.0°C (Predicted)
Density: 1.29 g/cm³
Vapor Pressure: 0.002Pa at 25°C
Water Solubility: 145mg/L at 20°C
Storage Conditions: Inert atmosphere, 2-8°C.
Chemical Properties Acidity (pKa): 7.69±0.58 (Predicted)
Safety: Irritant (Xi hazard class).
Synthesis Methods Involves multi-step reactions under inert atmosphere and low temperatures. Key steps include:
– Lithiation of bromo precursor.
– Reaction with boron reagents at cryogenic temperatures.
– Work-up and purification to isolate the final product. Detailed conditions require consultation with chemical literature or experts.
Applications Chemical Industry: Used as welding agents, multifunctional lubricants, and flame retardants.
Organic Synthesis: Key intermediate in pharmaceuticals, chemicals, and materials due to its fluoro and ethoxy substitutions.
Supplier Information Suppliers: Shanghai Hewens Chemical Co., Ltd., Hubei Nuona Technology Co., Ltd.
Price: Varies by supplier and packaging; contact suppliers for quotes.

 

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