Electronic Adhesive

Epoxy adhesive is a structural adhesive with high bonding strength. Suitable for bonding various substrates, especially with high bonding strength to metal materials.

Property	Single-Component Epoxy	Two-Component Epoxy
Composition	Single resin with latent curing agent.	Resin + separate curing agent (e.g., polyamide).
Curing Method	Heat-activated (e.g., 80–180°C).	Mixing resin and curing agent; room temp. or heat-cured.
Key Applications	Fast-production electronics, low-temp processes, consumer goods.	High-strength bonding (metals, composites), aerospace, automotive.
Advantages	Simplified storage, rapid curing in heat, no mixing required.	Superior adhesion, chemical resistance, adjustable cure speed.
Limitations	Brittle when cured, limited shelf life (requires refrigeration).	Shorter pot life after mixing, requires precise mixing ratio.

Compared to other types of adhesives, epoxy adhesives have better resistance to high temperatures and chemical corrosion, low shrinkage and cohesive strength, and are widely used in the fields of electronics, automotive, industry, and aviation.

Epoxy adhesives are divided into two types: single component and two-component. Single component epoxy adhesives can be divided into low-temperature curing epoxy, medium temperature curing epoxy, and high-temperature curing epoxy according to different curing temperatures. Low temperature curing epoxy is widely used in consumer electronics products. Its advantage is that the curing temperature is as low as 80 ℃ and the curing time can be controlled within 15-30 minutes. It can effectively meet the demand for fast production pace. Compared to single component products, two-component epoxy adhesives have a wider range of application scenarios and lower storage requirements. Typically, two-component epoxy does not require low-temperature storage.

At present, Moutainchem Electronics’ single component epoxy has mature applications in industries such as magnet bonding, motor bonding, VCM motor bonding, camera module bonding, and optical communication.

Epoxy Adhesive Systems Technical Summary

Property	Single-Component	Two-Component
Composition	Pre-mixed resin/hardener	Separate resin & hardener
Curing Mechanism	Heat-activated	Chemical reaction at RT or heat-accelerated
Pot Life	N/A (pre-mixed)	5 min – 24 hrs (varies by formulation)
Cure Time	15-60 min @ 120-180°C	2 hrs – 7 days (RT cure)
Typical Viscosity	10.000-50.000 cP	5.000-30.000 cP (resin)
Storage Conditions	-20°C to 5°C (uncured)	RT (separate components)
Shelf Life	3-12 months	12-24 months

Performance Characteristics

Parameter	Both Systems
Tensile Strength	20-50 MPa
Shear Strength	15-40 MPa
Temperature Resistance	-40°C to +150°C (standard)
Chemical Resistance	Excellent to oils, solvents
Shrinkage	<1%

Application Comparison

Feature	Single-Component	Two-Component
Ease of Use	Simple application	Requires mixing
Equipment Needed	Heating oven	Mixing tools
Best For	High-volume production	Custom applications
Bondable Substrates	Metals, ceramics	Metals, plastics, composites

Safety & Handling

Aspect	Both Systems
Skin Contact	Wear nitrile gloves
Eye Protection	Safety goggles required
Ventilation	Adequate airflow needed
Cured Material	Non-hazardous

Note: Single-component systems offer processing efficiency while two-component systems provide formulation flexibility. Selection depends on production requirements, substrate types, and performance needs.

 

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