Electronic Adhesive

With the increasing demand for consumer electronics and the development of autonomous driving in automobiles, the demand for camera modules in the consumer electronics and automotive markets has significantly increased, and the demand for adhesive parameters in this application is also constantly increasing. The camera module has extremely high requirements for the precipitation, strength, aging resistance, as well as the morphological changes, thermal expansion changes, and curing efficiency of the adhesive after curing. For example, the lens part has good temperature resistance, light resistance, and aging resistance when in contact with the outside for a long time, and the precipitation rate is strictly controlled to avoid contaminating the lens and affecting imaging.

Property	Camera Adhesive
Composition	Epoxy or acrylic-based formulations with low shrinkage and high thermal stability.
Curing Method	UV/LED curing or thermal curing (heat-activated).
Key Applications	Bonding camera lenses, image sensors, and modules; securing components in high-precision assemblies.
Advantages	High bond strength, resistance to thermal cycling/vibration, low outgassing (NASA ASTM E595 compliant).
Limitations	Brittle if not properly formulated; requires precise application for optical alignment.
Industry Use	Critical in smartphone, automotive, and aerospace camera modules for reliability.

Notes:

UV-Curable Adhesives: Enable rapid processing in manufacturing, often used for active alignment applications.

Thermal Stability: Ensures consistent performance in temperature-sensitive camera environments.

Low Outgassing: Important for vacuum-sealed or sensitive optical components to prevent contamination.

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